| Markenbezeichnung: | HSTECH |
| Modellnummer: | HS-520 |
| MOQ: | 1 Stk |
| Preis: | Negotation |
| Zahlungsbedingungen: | T/T |
| Versorgungsfähigkeit: | 50 PC/Monat |
The Manual BGA Rework Station is a highly precise and versatile rework solution designed for the efficient removal, placement, and soldering of Ball Grid Array (BGA) and other surface-mount components. Engineered for both professional repair shops and R&D laboratories, this equipment combines advanced thermal management with user-friendly manual operation. Whether you are repairing laptop motherboards, server boards, or LED panels, this rework station ensures high-yield soldering results through independent multi-zone heating, precise optical alignment, and customizable temperature profiles.
| Model | HS-520 |
| Power Supply | AC 220V±10% 50/60Hz |
| Total Power | 3800W |
| Overall Dimensions | L460mm × W480mm × H500mm |
| PCB Size | Max 300mm × 280mm / Min 10mm × 10mm |
| BGA Size | Max 60mm × 60mm / Min 1mm × 1mm |
| PCB Thickness | 0.3-5mm |
| Weight | 20KG |
| Warranty | 3 Years (First Year Free) |
| Applications | Chips, Phone Motherboards, and Electronic Components |
This manual BGA rework station is widely applicable across various electronics manufacturing and repair sectors:
Achieve flawless BGA rework with confidence. Our Manual BGA Rework Station provides the perfect balance of precision, reliability, and affordability. Contact us today to request a quotation, product video, or technical consultation. Let us help you optimize your repair workflow and deliver superior quality results.
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