Oberheizung 1200 W (max.), Unterheizung 1200 W (max.)
Stromversorgung:
Wechselstrom 100 V / 220 V ± 10 % 50/60 Hz
Montagegenauigkeit:
±0,01 mm
Gesamtabmessungen:
L450mm × B470mm × H670mm
Verpackung Informationen:
Aus Holz
Versorgungsmaterial-Fähigkeit:
50 PC/Monat
Hervorheben:
Touch Screen BGA Rework Station
,
High Speed PCB Rework Station
,
CCD Optical Alignment Rework Station
Beschreibung des Produkts
High Speed Touch Screen BGA Rework Station 5 Modes Stepping Motor CCD Color Optical Alignment System 0 01mm Mounting Accuracy BGA Chip Repair Machine SMT Component Rework Equipment For Motherboard IC Chip Repair Product Introduction The Manual BGA Rework Station is an advanced, professional-grade repair equipment engineered for the precise removal, placement, and reballing of Ball Grid Array (BGA) components. Designed to meet the rigorous demands of modern electronics